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The 3rd Annual Asia Pacific Bond Congress

Date: 12 June 2006 - 13 June 2006
Venue: The Grand Hyatt, Hong Kong, Hong Kong
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On June 12-13 2006 over 800 top-level executives gathered in Hong Kong for The 3rd Annual Asia Pacific Bond Congress. The seniority of delegates and large numbers in attendance once again reaffirm the congress as Asia leading event for the region’s bond markets.

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The 3rd Annual Asia Pacific Bond Congress